Programs
The CEEMAN’s extensive programs provide an excellent platform for discussions and thinking about how the improved quality of management and management schools can be the catalyst to drive urgently needed changes, innovation and creativity.
Matej Potokar,
General Manager, Microsoft Services CEE,

Network events

30
Jun
2025
12
Jul
2025

Entrepreneurship in Digital Era: 2025 CUFE International Summer School

Location:
Source:
  • Members
In today's rapidly developing digital technology, many industry markets have been dramatically transformed by business model innovations such as multilateral digital marketplaces, social media, e-commerce and software instant services, and the digital entrepreneurial activities inspired by these have become the focus of attention from all sectors of society. The CUFE International Summer School will focus on the theme of entrepreneurship in digital era, which will provide new learning experiences for studentsfrom different cultural backgrounds, helping them to improve their innovative thinking and global vision.

Important Dates

Application Deadline: 15th May, 2025

Classroom Learning and Workshops: 30th June - 10th July, 2025

Corporate Visit: 11th July, 2025

The 2025 CUFE International Summer School will be held at the South Xueyuan Road Campus of Central University of Finance and Economics (CUFE), located at 39 South Xueyuan Road, Haidian District, Beijing, China.

Event Highlights

Insightful Courses:

  • Working in Teams

  • Digital Entrepreneurship

  • Entrepreneurial Marketing

These courses will provide knowledge sharing in the classroom and experiential learning outside the classroom.

Corporate Visit:

The Science Part and New ventures in Beijing-Tianjin-Hebei Region

The summer school will also invite senior professors in the field of entrepreneurship to give academic lectures on entrepreneurship, which will provide students with academic insights and help improve their ability to analyze and creatively solve problems.

Read more: https://www.cufe.edu.cn/info/1186/23973.htm 
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